Box of 10 DISCO B1A801 SD400N50M51 Metal Bond Diamond Dicing Blades (B429) New
Business & Industrial|CNC, Metalworking & Manufacturing|Semiconductor & PCB Manufacturing Equipment|Wafer Processing|Wafer Processing Components

Box of 10 DISCO B1A801 SD400N50M51 Metal Bond Diamond Dicing Blades (B429)

USD $235.00
Seller: dmann131313
(9,460 reviews)
Modesto, US
Only 5 left
US

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Specifications

Brand Disco
Component Type Disco wafer Blade
MPN B1A801 SD400N50M51
Country of Origin Japan